M08500 - SEMI M85 - Guide for the Measurement of Trace Metal Contamination on Silicon Wafer Surface by Inductively Coupled Plasma Mass Spectrometry StdTpc-Glass Wafer 1 — Specification for Inspection

1 — Specification for Inspection and Review Specific Equipment Model (ISEM)

SEMI F72-0309 (technical revision)

SEMI D22 — Test Method for the Determination of Color

This Guide covers the shipping of 300 mm nominally diameter silicon wafers

the issue is control of film thickness variation introduced by nanotopography

M08500 - SEMI M85 - Guide for the Measurement of Trace Metal Contamination on Silicon Wafer Surface by Inductively Coupled Plasma Mass Spectrometry StdTpc-Glass Wafer 1 — Specification for InspectionReduction of surface metal contamination below a concentration in accordance with the ITRS road map is a key issue for silicon wafer quality for most of the leading edge technology applications. This Document provides a guide for a high sensitivity measurement of trace metal contamination on the surface of a semiconductor grade silicon wafer by using inductively coupled plasma mass spectrometry (ICP MS). This Guide describes the procedure for trace