G09000 - SEMI G90 - Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes Revision:SEMI G90-0811 (Reapproved 0318) - Superseded This test procedure evaluates quantitatively

This test procedure evaluates quantitatively the durability of flat panel display (FPD) glass substrates using reagents employed in FPD production processes

6-81 (first published)

A surface area per mass value is then calculated using the appropriate formula and the measured values

Because the zero point on the z-axis is application specific

Semiconductor processing equipment includes equipment intended for wafer manufacturing

G09000 - SEMI G90 - Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes Revision:SEMI G90-0811 (Reapproved 0318) - Superseded This test procedure evaluates quantitativelyThe purpose of this Standard is to standardize the specifications for 300 mm wafer coin stack type shipping container used for test and packaging processes for wafers. This Specification defines the dimensions of container (refer to 5. 1. 1) and requirements for securing the interface between container and processing equipment or wafer transportation equipment. This Standard specifies the requirements for wafer spacers used for separation of wafers