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2 The recommended equipment installation documentation should cover all installation requirements from receiving until hookup is complete
It does not apply to scatter from translucent or transparent materials
Procedure B is the conventional DLTS (Procedure A) with corrections for non-exponential transients due to heavy trap doping and incomplete charging of the depletion region
The Test Method does not cover measurement of surface flatness
Considerations relating to corrosion resistance are outside the scope of the present Standard
P04000 - SEMI P40 - Specification for Mounting Requirements for Extreme Ultraviolet Lithography Masks Revision:SEMI P40-1109 (Reapproved 1221) - Current 2 The recommended equipment installationThis Specification covers the mounting requirements for extreme ultraviolet lithography (EUVL) masks in select tools. This Standard details the requirements for EUVL mask mounting. The mask mount is a flat reference surface against which the mask is clamped. The specific design and material of the mask mount are not specified. The mounting requirements in this Standard apply to the EUV exposure tools. These mounting requirements may be used in other
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