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G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Revision:SEMI G97-0116 - Superseded Since there are more and

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Description

Since there are more and more applications of electronic paper displays on the market nowadays

Underwriter’s Laboratory

previously published August 2012

The procedures described in this Standard measure the time constant t of a network consisting of the resistive sample and the series capacitance of the sample and the capacitive sensor

Detailed explanation of the principles of operation and construction of the instruments used is beyond the scope of this Guide

G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Revision:SEMI G97-0116 - Superseded Since there are more andNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Standard describes procedures for measuring the mechanical, physical, chemical, thermal, and electrical properties of leadframe tape. Equipment, sampling, and procedures are referred to in the individual test methods.

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