M04300 - SEMI M43 - Guide for Reporting Wafer Nanotopography Revision:SEMI M43-1109 - Superseded SEMI E40-0705E (editorial revision)

SEMI E40-0705E (editorial revision)

SEMI G18 — Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes

automation and metrology systems used in the Front-End and Back-End production area

In conjunction with a SEMI SAN common device model (CDM) specification and one or more SEMI specific device model (SDM) specifications (e

3-1016 (technical revision)

M04300 - SEMI M43 - Guide for Reporting Wafer Nanotopography Revision:SEMI M43-1109 - Superseded SEMI E40-0705E (editorial revision)This Guide provides a framework for reporting of nanotopography surface features on silicon wafers. This Guide addresses reporting the characterization of nanotopography surface features found on wafer surfaces. Nanotopography is the non planar deviation of the whole front wafer surface within a spatial wavelength range of approximately 0. 2 to 20 mm and within the fixed quality area (FQA). Typical examples include dips, bumps or waves on the wafer