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1-1104 (Reapproved 0723)
偏りおよび偏りに関連する次の項目を含む
Process and quality control during manufacturing of wafers requires continuous monitoring of waviness with a noncontact method that supports high throughput
but that is beyond the scope of this Standard
Existing international standards use full screen sequential test patterns that are not suitable for modern FPD systems that dynamically adjust gray levels based on image contents
G02700 - SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages StdTpc-Silicon Materials & Process Control 1-1104 (Reapproved 0723)This specification is a guideline for high volume production of leadframes for plastic leaded chip carrier semiconductor packages. It is a design guideline for packaging engineers, leadframe stampers, and mold manufacturers, and has been developed to meet the requirements of automatic assemblers. Referenced SEMI Standards SEMI G4 Specification for Integrated Circuit Leadframe Material SEMI G10 Standard Method of Mechanical Measurement for Leadframes